Manufacturing services
Manufacturing Services <Domestic Manufacturing> ◆We can accommodate from any perspective◆
【Features of Manufacturing Services】 ● Capable of SMD mounting on ultra-large substrates Substrate size: Minimum 50(W) × 50(L) × 1(t) mm / Maximum 460(W) × 510(L) × 3(t) mm ● Achieving high precision and high-density mounting - Minimum chip size: 0402 - QFP minimum pin pitch: 0.2mm - BGA minimum ball pitch: 0.25mm ● Soldering - In response to the issue of lead contamination in the environment (products using lead are subject to regulation), lead-free reflow and wave soldering ovens have been introduced. - No-clean processes are implemented in an N2 (nitrogen) atmosphere, compatible with reflow ovens and automatic soldering baths. - A separate building is completely isolated for lead-free manual soldering work areas to prevent contamination with leaded solder. For more details, please contact us.
- Company：ロッキー
- Price：Other
